Molex Incorporated 43030-0007
Micro-Fit 3.0 Crimp Terminal Socket with Tin (Sn) Plated Tin/Brass Alloy Contac
Mfr. Part #: 43030-0007 / RS Stock #: 70190802
Price
Qty.
Standard Price
1
$0.24186
10
$0.20558
25
$0.18865
50
$0.17413
100
$0.16204
500
$0.14995
1000
$0.13302
Additional Inventory
Manufacturer Lead Time:
14 weeks
Estimated manufacturer lead time is for quantities greater than shown above.
Bulk pricing available
Product Specifications
Product Attribute
Attribute Value
Search
Alternate Mfr Part Number
43030-0007
Contact Material
Tin⁄Brass Alloy
Contact Type
Socket
Current Rating
8.5 A
Family Name
Micro-Fit 3.0
Gender
Female
Insulation Diameter
0.073 in. (Max.) (Wire) in
Number of Contacts
3
Plating Material
Tin
Special Features
Low-Halogen
Standards
RoHS?/ELV Compliant
Wire Size
20-24 AWG
Overview
Micro-Fit 3.0™ Connectors
Micro-Fit 3.0™ Connectors are a 3.00mm pitch high-density, low-power connector system available in wire-to-wire and wire-to-board configurations with SMT and through-hole options and up to 5.0A to meet low- to mid-range power application needs. Molex’s Micro-Fit 3.0 Interconnects offer users a low- to mid-range power-distribution solution with the highest current in the smallest footprint available today. Based on a 3.0mm centerline Micro-Fit 3.0 is available in wire-to-wire and wire-to-board configurations, SMT and through-hole processing, 2 to 24 circuits and single- and dual-row versions. Micro-Fit 3.0 Connectors can be purchased in pure tin or one of two thicknesses of select gold to provide costs savings. Contacts are fully isolated on each side of the interface to eliminate potential arcing and incorporate four points of contact for redundancy. The housings utilize positive-lock features to prevent accidental disconnects. Micro-Fit 3.0 Interconnects are UL recognized, CSA approved and TUV licensed. All components are leadfree, RoHS compliant, halogen free and glow wire capable.
Micro-Fit 3.0™ Connectors are a 3.00mm pitch high-density, low-power connector system available in wire-to-wire and wire-to-board configurations with SMT and through-hole options and up to 5.0A to meet low- to mid-range power application needs. Molex’s Micro-Fit 3.0 Interconnects offer users a low- to mid-range power-distribution solution with the highest current in the smallest footprint available today. Based on a 3.0mm centerline Micro-Fit 3.0 is available in wire-to-wire and wire-to-board configurations, SMT and through-hole processing, 2 to 24 circuits and single- and dual-row versions. Micro-Fit 3.0 Connectors can be purchased in pure tin or one of two thicknesses of select gold to provide costs savings. Contacts are fully isolated on each side of the interface to eliminate potential arcing and incorporate four points of contact for redundancy. The housings utilize positive-lock features to prevent accidental disconnects. Micro-Fit 3.0 Interconnects are UL recognized, CSA approved and TUV licensed. All components are leadfree, RoHS compliant, halogen free and glow wire capable.
